Although not limited, papers are solicited for the following main topics:

 

Advanced Technology, Process and Materials 

Process and material developments for logic, memory, and non-CMOS, including electrical and physico-chemical characterization, process integration and manufacturing: 2D TMDs and related insulators (e.g., hBN), graphene, TFTs, gate oxide, gate material, silicide, MOL and BEOL materials, 3D monolithic as well as conventional and novel memory cells including charge-based memories, ReRAM, MRAM, PCRAM, ferroelectrics, crosspoint and selectors, organic memory.

 

Analog, Power and RF Devices 

From material growth to device, components, and systems (process, design, devices fabrication, applications). Device design and electrical/ physical/electro-thermal/reliability characterization of devices based on Si RF CMOS, RF SOI, SiGe HBTs, SiC, InP/InGaAs/ GaAs, AlGaN/InGaN/GaN, CNT, diamond, and related material systems. Power systems integration issues including thermal management, packaging technologies, system-level electro thermal characterization, product quality and system reliability aspects. Device production processes and design for manufacturability.

 

Modelling and Simulation of Electron Devices 

Modelling and simulation of electronic devices, including, Logic, Analog/RF, Power, Optical, Sensors, MEMS and Memory applications. Methodologies include TCAD (process and device simulation), Design-Technology Co-Optimization (DTCO), physics-based compact modelling, numerical, statistical, and ML/AI-based methods. Key topics of interest are Emerging Devices including 1D/2D and organic materials, non-classical transport, and new memory concepts, Neuromorphic Computing, Cryogenic Electronics and Quantum Computing, Variability and Reliability modelling including radiation effects, Device-Circuit Co-Design, and 3D-Integration including Thermal modelling. Multi-scale modeling that includes one or more of the following levels: atomistic, mesoscopic, single-device, cell, circuit, block, and system level simulations, multiscale modelling chains and interactions between TCAD and compact modelling as well as mutli-scale modelling for 3D/heterogeneous integration, is of particular interest. Model validation with experimental data is highly encouraged.

 

Analog Circuits 

Building blocks, systems, and techniques operating in the analog or mixed-signal domain, such as amplifiers, drivers, comparators, filters, references, analog systems, analog interfaces, and analog techniques.

 

Data Converters 

Nyquist-rate and oversampling A/D and D/A converters. Capacitance-to-digital, time-to-digital, frequency-to digital converters. Embedded and application-specific A/D and D/A converters. Analog to information conversion. A/D and D/A converter building blocks (sample-and-hold circuits, calibration circuits). Enabling new techniques, architectures, or technologies.

 

RF & mm-Wave Circuits 

Building blocks and front-ends operating at RF, mm-Wave and THz frequencies for wireless communication, radar, sensing, and imaging.

 

Frequency Generation Circuits 

Oscillators and controlled oscillators, PLL, DLL, injection locked oscillators, frequency dividers, any kind of frequency generation or time base circuits and systems.

 

Digital Circuits & Systems 

Digital circuits and memory subsystems for microprocessors, micro-controllers, application processors, graphics processors; digital systems for communications, video, multimedia, security, and cryptography applications. Digital design techniques for power reduction, intra-chip communication, clock distribution, soft-error and variation-tolerant design, system-level integration. Devices and circuits for IoT and IoE security (e.g., PUFs, TRNGs).

 

Power Management 

Power management and control circuits. Regulators. Switched-mode power converter ICs using inductive, capacitive, and hybrid techniques. Energy harvesting circuits and systems. Wide-bandgap topologies and gate-drivers. Power and signal isolators; robust power management circuits for automotive and other harsh environments. Circuits for lighting, wireless power and envelope modulators. Design for manufacturability.

 

Wireless Systems 

Wireless systems: radio transceivers, highly integrated front-ends, SoCs and SiPs, incl. heterogeneous packaging solutions, at RF, mmWave or THz frequencies, for established or future standards, as well as novel applications such as radar, sensing, and imaging.

 

Wireline and Optical Circuits and Systems 

2.5/3D interconnect, copper-cable links, and equalizing on-chip links, exploratory I/O circuits for advancing data rates, chip to chip system communications, high speed serial interfaces, optical interfaces, laser drivers, optical receivers, clock and data recovery.

 

Emerging Computing Devices and Circuits 

Novel devices and circuits to improve existing and enable new computing paradigms. In-memory computing and logic-in-memory using emerging devices. Qubit devices and cryogenic circuits for quantum computing. Non-charge-based logic devices and circuits (magnetic logic, spintronics and plasmonics), beyond CMOS transistors (tunnel FETs, Dirac-source FETs). Devices and circuits based on low-dimensional systems (2D materials, nanowires etc.), topological insulators, and phase transitions.

 

Architectures and Circuits for AI and ML 

Silicon implementations of AI, ML, neuromorphic accelerators and processors, together with their applications. Edge and cloud AI computing platforms. In- and near-memory computing at the array/processor-level using commercially available technologies.

 

Devices & Circuits for Sensors, Imagers and Displays 

Devices and circuits based on MEMS and bioelectronics devices for biomedical and imaging applications. Image sensors and related circuits and systems, SoCs. Automotive, LIDAR, and ultrasonic sensors for ADAS, autonomous driving, smart mobility. MEMS sensor systems. Wearable, implantable, ingestible electronics, biomedical SoCs, neural interfaces and closed-loop systems. Biosensors, microarrays, and lab-on-a-chip. Display electronics, displays with sensing functionality. Devices, circuits, and systems for AR/VR and related sensing/actuation. Product quality and reliability aspects. Device and circuits production processes and design for manufacturability.